Trainer – Semiconductor Fab & Process Engineering

Job Purpose

To provide theoretical and practical training in semiconductor fabrication and process engineering, covering wafer processing, process integration, process control, yield, defect analysis and semiconductor manufacturing equipment.

Key Responsibilities

• Train learners on the complete semiconductor manufacturing process, from wafer preparation to inspection and testing.
• Teach key fabrication processes including cleaning, oxidation, deposition, lithography, etching, doping, CMP and metallisation.
• Explain process windows, yield management, defect mechanisms and Statistical Process Control (SPC).
• Conduct practical demonstrations and wafer-process measurement exercises.
• Explain semiconductor process equipment, chambers and equipment functions.
• Develop troubleshooting exercises and root-cause analysis case studies.
• Train learners on contamination control and process-quality practices.
• Coordinate with cleanroom, vacuum and materials-related trainers.

Required Skills & Experience

• 8–15 years of experience in semiconductor fabrication, process engineering, process integration or semiconductor equipment.
• Strong knowledge of wafer fabrication, process integration, SPC, yield, metrology and defect analysis.
• Understanding of cleanroom operations, contamination control and equipment utilities.
• Strong process troubleshooting and root-cause analysis skills.

Preferred Background

• Experience with semiconductor fabs, foundries, IDMs, wafer-processing companies, semiconductor equipment manufacturers or advanced-materials companies.
• Practical exposure to semiconductor manufacturing processes and equipment.